Role and Responsibilities:
1. Conduct in-depth research on technology trends, market demand, and competitor dynamics in the multi-layer PCB industry; formulate practical medium- and long-term product strategy in alignment with the company’s strategy.
2. Based on the R&D strategy, make a budget and allocate resources to ensure the progress of every project.
3. Establish and improve the R&D project management system; conduct process control over R&D projects, track project progress, quality, and costs regularly; solve problems arising in projects in a timely manner to ensure projects are completed on schedule, with required quality, and within budget.
4. Lead team in conducting product research and development, and tackling key technologies of multi-layer PCB, focusing on overcoming technical challenges in advanced fields such as High-Density Interconnect (HDI), high-speed signal transmission, thick copper, buried/blind vias, and rigid-flex combination, so as to enhance the company’s product technical capabilities and competitiveness.
5. Promote technological innovation within the R&D team; lead team members to actively explore new technologies, new materials, and new processes in projects.
6. Pay close attention to technological innovation achievements in the industry; organize the layout of patents and intellectual property protection; accumulate the company’s patent assets through independent R&D, technical cooperation, and other means.
7. Be responsible for team management and talent development; establish a reasonable talent echelon based on the needs of R&D projects and the team development plan.
8. Provide technical support for NPI and mass production, solve technical problems encountered in the production process, ensure the smooth transfer of products to mass production, and guarantee the delivery of customer orders.
9. Conduct technical communication with customers, organize technical resources, provide product solutions for customers, and achieve customer satisfaction.
Qualifications:
1. Master’s degree or above in relevant science and engineering majors, such as Electronic Information Engineering, Microelectronics, Materials Science and Engineering, Mechatronic Engineering, Communication Engineering, etc.
2. Proficiency in professional knowledge, including circuit principles, PCB design theory, material physics, semiconductor technology, and signal integrity analysis; familiar with PCB-related industry standards.
3. Over 10 years of technical experience in the multi-layer PCB industry, including at least 5 years of experience in R&D management positions; familiar with High-Density Interconnect (HDI) PCBs and high-speed/high-frequency PCBs.
4. Experience in leading teams to overcome key technical challenges in multi-layer PCBs, such as successfully breaking through the manufacturing process of high-end HDI boards with 20+ layers, realizing stable mass production of PCBs with high-speed signal transmission of 56Gbps or above, and solving the interlayer bonding force problem of thick copper (3oz and above) PCBs.
5. Possession of rich industry technical resources; familiar with the supply chain in the PCB industry; ability to introduce external technical support or cooperation resources for the company’s R&D projects.
6. Proficiency in the use of advanced R&D tools and testing equipment in the industry; ability to use relevant software (such as Altium Designer, Cadence Allegro, Ansys SIwave, etc.) for PCB design, simulation, and analysis.
7. Ability to capture the technological development trends of the industry, propose new ideas and solutions, and quickly solve various technical problems encountered in the product development process.
8. Strong communication, coordination, and organizational skills, with proven leadership and management capabilities, including the ability to engage and collaborate effectively in English with Global Tier-1 customers.
Company Profile:
We are a Korean company with production facilities in the USA, Vietnam, and other regions, recognized as a high-tech global leader. We provide advanced manufacturing services to top-tier customers including Ericsson, Nokia, Samsung, Arista (Google, Microsoft, Meta), HPE, Amazon, Hyundai Motors, and others across communications, energy storage systems, and semiconductor industries. Leveraging our world-class manufacturing technology and cost-optimization capabilities, we have established ourselves as a trusted global partner, delivering on customer needs and advancing new technologies through continuous collaboration and communication.